Characterization and validation of material models for thin sheet metal materials using MUC tests

Project description

The MUC-Transfer project aims to develop a holistic characterization and validation process for material cards (i.e., structured input data for describing materials behavior in simulations) of thin sheet metal materials for industrial use. Specifically, the aim is to create and validate material maps for thin sheet metal materials that are difficult to characterize and to make them available for the precise design of single- or multi-stage forming processes – a central component of the digital transformation in sheet metal forming.

The starting point is the MUC test (MUC = Materials under Control) developed by the Technical University of Munich as part of a DFG basic research project, which allows for improved prediction quality of simulation models in complex deformation states. As part of MUC-Transfer, these findings are being combined with the Virtual Laboratory (link) available at Fraunhofer IWM and further developed for application to thin sheet metal materials.

Together with the application partner thyssenkrupp Rasselstein, the novel method is to be applied to packaging steel as an example and transferred to industrial practice. The focus is on high-strength and formable packaging grades, as these enable a reduction in thickness and thus materials savings while maintaining functionality. With an annual production volume of around 1.5 million tons of packaging steel by thyssenkrupp Rasselstein GmbH – about one-tenth of global demand – there is enormous potential here for increasing efficiency and conserving resources.

Fraunhofer IWM subproject:

Fraunhofer IWM contributes its expertise in the field of simulation-based materials characterization, in particular through its Virtual Laboratory. This is being further developed in the project specifically for thin sheet materials with a thickness of less than 0.30 mm. The aim is to generate precisely adapted materials data for simulating the behavior of sheet materials and to validate it with the MUC test.

In addition, the methods used are being further developed with a view to transferable use in other fields of application (e.g., bipolar plates, sensors, plug connections). A particular focus is on the development of a user-friendly interface and a web-based version of the Virtual Laboratory in order to significantly simplify and accelerate its application in industry.