We are specialists in glass, ceramics and semiconductor materials. Our core competencies lie in fracture-mechanical analysis methods and manufacturing processes with a focus on hot glass forming, ultra-precision processing, joining techniques and special separation and cutting techniques. A particular focus is placed on edge-bonding techniques for vacuum-insulating glass, low-damage machining techniques for precise contours in precision components, as well as separation techniques for sheets of laminated glass. Our findings lead to solutions for new processes and products and to the informed assessment of their cost-effectiveness and feasibility in industrial use.
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How to work with the Fraunhofer IWM