Oxides for flexible and transparent electronics (oxide materials for the post-silicon electronics era)

Completed research project

The ORAMA project aimed to develop high-performance, multifunctional oxide-based electronic materials.

Project description

The ORAMA project was dedicated to the development of new, high-performance, multifunctional oxide-based electronic materials that could be processed at low temperatures — including on flexible substrates. These innovations had the potential to lead the electronics industry into a new phase of growth.
Within ORAMA, novel materials and techniques were developed, analyzed, and applied to research innovative device concepts. In particular, the potential of oxides as electronic materials for the automotive industry — a highly competitive sector crucial to European industry — was investigated. This sector placed high demands on information and sensor technologies, as well as on resource-saving and energy-efficient solutions for sustainable mobility in Europe.
To achieve these goals, ORAMA focused on four key elements:

  • Materials modeling
  • Synthesis of novel materials
  • Development of low-temperature and damage-free deposition and structuring techniques
  • New methods for characterizing materials

Fraunhofer IWM subproject:

  • Modeling of amorphous structures (e.g., InGaZnO, ZnSnO, etc.) using molecular dynamics and density functional theory
  • Calculation of electronic state densities and thus optical transparency using the SIC method (for further details, see, e.g.: Origin of subgap states in amorphous In-Ga-Zn-O Wolfgang Körner, Daniel F. Urban, and Christian Elsässer, J. Appl. Phys. 114, 163704 (2013) doi: 10.1063/1.4826895)

Transfer of project results to the following Fraunhofer IWM R&D services for companies:

  • Adaptation and synthesis of new oxide-based materials for electronics and sensor technology.
  • Digital materials modeling for process optimization and efficiency improvement.
  • Development of low-temperature and damage-free deposition methods.
  • High-precision analysis methods for materials and process evaluation.
  • Integration of new materials in automotive, electronics, and sensor technologies.

Funding information